Maintained for Historical Purposes

This resource is being maintained for historical purposes only and is not currently applicable.

Lender's Application Process (LAP)

Publication Date: December 2002

Page Numbers: 78427-78428

Lender's Application Process (LAP)

Posted on 12-24-2002


[Federal Register: December 25, 2002 (Volume 67, Number 247]
[Page 78427]
From the Federal Register Online via GPO Acess
[DOCID: FR24DE02-59]


Submission for OMB Review; Comment Request

AGENCY: Department of Education.
SUMMARY: The Leader, Regulatory Management Group, Office of the Chief
Information Officer invites comments on the submission for OMB review
as required by the Paperwork Reduction Act of 1995.

DATES: Interested persons are invited to submit comments on or before
January 23, 2003.

ADDRESSES: Written comments should be addressed to the Office of
Information and Regulatory Affairs, Attention: Lauren Wittenberg, Desk
Officer, Department of Education, Office of Management and Budget, 725
17th Street, NW., Room 10235, New Executive Office Building,
Washington, DC 20503 or should be electronically mailed to the internet

SUPPLEMENTARY INFORMATION: Section 3506 of the Paperwork Reduction Act
of 1995 (44 U.S.C. Chapter 35) requires that the Office of Management
and Budget (OMB) provide interested Federal agencies and the public an
early opportunity to comment on information collection requests. OMB
may amend or waive the requirement for public consultation to the
extent that public participation in the approval process would defeat
the purpose of the information collection, violate State or Federal

law, or substantially interfere with any agency's ability to perform
its statutory obligations. The Leader, Regulatory Management Group,
Office of the Chief Information Officer, publishes that notice
containing proposed information collection requests prior to submission
of these requests to OMB. Each proposed information collection, grouped
by office, contains the following: (1) Type of review requested, e.g.
new, revision, extension, existing or reinstatement; (2) Title; (3)
Summary of the collection; (4) Description of the need for, and
proposed use of, the information; (5) Respondents and frequency of
collection; and (6) Reporting and/or Recordkeeping burden. OMB invites
public comment. 

    Dated: December 19, 2002.
John D. Tressler,
Leader, Regulatory Management Group, Office of the Chief Information

Federal Student Aid�

  Type of Review: Extension.
  Title: Lender's Application Process (LAP).
  Affected Public:
  State, Local, or Tribal Gov't, SEAs or LEAs; Businesses or other for-profit.   Reporting and Recordkeeping Hour Burden:
  Responses: 121.
  Burden Hours: 20.
  Abstract: The Lender's Application Process is submitted by lenders
who are eligible for reimbursement of interest and special allowance,
as well as Federal Insured Student Loan (FISL) claims payment, under

the Federal Family Education Loan Program. The information will be used
by ED to update Lender Indentification Numbers (LID's) lenders names,
addresses with 9 digit zip codes and other pertinent information.
  Written requests for information should be addressed to Vivian
Reese, Department of Education, 400 Maryland Avenue, SW., Room 4050,
Regional Office Building 3, Washington, DC 20202-4651 or directed to
her e-mail address Requests may also be faxed to
202-708-9346. Please specify the complete title of the information
collection when making your request.
  Comments regarding burden and/or the collection activity
requirements should be directed to Lew Oleinick at

[[Page 78428]]

his e-mail address Individuals who use a
telecommunications device for the deaf (TDD) may call the Federal
Information Relay Service (FIRS) at 1-800-877-8339.
[FR Doc. 02-32372 Filed 12-23-02; 8:45 am