|Publication Date: April 2002
Page Numbers: 19560
Summary: Lender's Application Process (LAP)comments due by May 22. 2002.
[Federal Register: April 22, 2002 (Volume 67, Number 77)] [Notices] [Page 19560] From the Federal Register Online via GPO Access [wais.access.gpo.gov] [DOCID:fr22ap02-34] ----------------------------------------------------------------------- DEPARTMENT OF EDUCATION. Submission for OMB Review; Comment Request AGENCY: Department of Education SUMMARY: The Leader, Regulatory Information Management Group, Office of the Chief Information Officer invites comments on the submission for OMB review as required by the Paperwork Reduction Act of 1995. DATES: Interested persons are invited to submit comments on or before May 22, 2002. ADDRESSES: Written comments should be addressed to the Office of Information and Regulatory Affairs, Attention: Lauren Wittenberg, Desk Officer, Department of Education, Office of Management and Budget, 725 17th Street, NW., Room 10235, New Executive Office Building, Washington, DC 20503 or should be electronically mailed to the Internet address Lauren_Wittenberg@omb.eop.gov. SUPPLEMENTARY INFORMATION: Section 3506 of the Paperwork Reduction Act of 1995 (44 U.S.C. Chapter 35) requires that the Office of Management and Budget (OMB) provide interested Federal agencies and the public an early opportunity to comment on information collection requests. OMB may amend or waive the requirement for public consultation to the extent that public participation in the approval process would defeat the purpose of the information collection, violate State or Federal law, or substantially interfere with any agency's ability to perform its statutory obligations. The Leader, Regulatory Information Management Group, Office of the Chief Information Officer, publishes that notice containing proposed information collection requests prior to submission of these requests to OMB. Each proposed information collection, grouped by office, contains the following: (1) Type of review requested, e.g. new, revision, extension, existing or reinstatement; (2) Title; (3) Summary of the collection; (4) Description of the need for, and proposed use of, the information; (5) Respondents and frequency of collection; and (6) Reporting and/or Recordkeeping burden. OMB invites public comment. Dated: April 16, 2002. John Tressler, Leader, Regulatory Information Management, Office of the Chief Information Officer. Federal Student Aid Type of Review: Extension. Title: Lender's Application Process (LAP). Frequency: Quarterly, Annually. Affected Public: State, Local, or Tribal Gov't, SEAs or LEAs; Businesses or other for-profit. Reporting and Recordkeeping Hour Burden: Responses: 121. Burden Hours: 20. Abstract: The Lender's Application Process is submitted by lenders who are eligible for reimbursement of interest and special allowance, as well Federal Insured Student Loan (FISL) claims payment, under the Federal Family Education Loan Program. The information will be used by ED to update Lender Indentification Numbers (LID's) lenders names, addresses with 9-digit zip codes and other pertinent information. Requests for copies of the proposed information collection request may be accessed from http://edicsweb.ed.gov, or should be addressed to Vivian Reese, Department of Education, 400 Maryland Avenue, SW., Room 4050, Regional Office Building 3, Washington, DC 20202-4651. Requests may also be electronically mailed to the internet address OCIO_IMG_Issues@ed.gov or faxed to 202-708-9346. Please specify the complete title of the information collection when making your request. Comments regarding burden and/or the collection activity requirements should be directed to Lauren Wittenberg, Desk Officer, Office of Management and Budget, at her Internet address Lauren_Wittenberg@omb.eop.gov. Individuals who use a telecommunications device for the deaf (TDD) may call the Federal Information Relay Service (FIRS) at 1-800-877-8339. [FR Doc. 02-9719 Filed 4-19-02; 8:45 am] BILLING CODE 4000-01-P