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This resource is being maintained for historical purposes only and is not currently applicable.

Summary: Availability of 2007-2008 School Electronic Process Guide

Publication Date: November 30, 2006

Author: G. Kay Jacks, General Manager, Application, Operations and Delivery Services, Federal Student Aid

Summary: Availability of 2007-2008 School Electronic Process Guide

Posted on 11-30-2006

Federal Student Aid is pleased to announce the posting of the 2007-2008 School Electronic Process Guide. This guide is designed to meet the reference needs of financial aid administrators (FAAs), programmers, and data processing staff.

In the guide, we describe 2007-2008 enhancements and other updates to the following areas:

  • Product Release Schedules
  • Message Classes
  • FAA Access to CPS Online
  • Return of Title IV Funds (R2T4) on the Web
  • ISIR Analysis Tool on the Web
  • EDExpress for Windows Release 1.0 (Global functionality, Application Processing, and Packaging modules)
  • EDExpress for Windows Release 2.0 (Pell, including Academic Competitiveness Grant [ACG] and National SMART Grant, and Direct Loan modules)
  • Direct Loan (DL) Tools for Windows
  • Student Status Confirmation Report (SSCR) for Windows

The 2007-2008 School Electronic Process Guide is available in PDF format on the Information for Financial Aid Professionals (IFAP) Web site, located at http://ifap.ed.gov. For readers who are viewing this message electronically on IFAP, the guide is provided as an attachment to this message. Otherwise, to view, print, or download the document from IFAP, go to http://ifap.ed.gov and click on "Application Processing Materials" from the right side of the home page.

The guide will also be available in the next several days from the Federal Student Aid Download (FSAdownload) Web site, located at http://fsadownload.ed.gov, under "Technical References and Guides."

If you have any questions regarding this message, contact CPS/SAIG Technical Support at 800/330-5947 (TDD/TTY 800/511-5806) or by e-mail at CPSSAIG@ed.gov.

Attachments/Enclosures:

Last Modified: 11/29/2006